Difference between revisions of "Reflow soldering workshop"

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[[File:wetrun3.png]]
 
[[File:wetrun3.png]]
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Comparing this profile to the 'ideal' solder profile, the main difference is that we do not dwell on the 'pre-heat' phase (ie. 150-200°C).  This is because we could not get the temperature to rise fast enough, so we were forced to stick to a steady, slow ramp.
  
 
= Results =
 
= Results =
The second run of 0603 resistors was a success:
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[[File:Smd_reflow_soldered_resistors.jpg|thumb|center|The second run of 0603 resistors was a success]]
[[File:smd_reflowed_resistors.jpg]]
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[[File:smd_reflow_soldered_ics.jpg|thumb|center|Some very fine pitch ICs]]
  
Some very fine pitch ICs:
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The results of the final profile were excellent. The main restriction of this technology is the precise application and dosing of the solder paste, and the placement of the components. We will experiment with using stencils next time. This should improve success rate significantly.
[[File:smd_reflowed_ics.jpg]]
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{{Subpages}}
 
{{Subpages}}
 
{{EventImages}}
 
{{EventImages}}

Latest revision as of 18:54, 13 December 2011

Note: this article is about a passed event.

Reflow soldering workshop
WhitespaceLogo.gif
From 2011/12/11 14:00:00 to 2011/12/11 18:00:00
Presenters (1):
johannes
Where:
Whitespace Blekerijstraat 75, Gent, Belgium
Loading map...

Costs 0

Cornify

Reflow soldering workshop not teaching, but testing this technique

tools available

Solder profiles and background info

Initial heater test[edit]

Initial.png

Programs used[edit]

Final program:

0	15s	40°C
1	150s	150°C
2	90s	215°C
3	90s	265°C
4	40s	265°C
5	120s	40°C

Final profile[edit]

Wetrun3.png

Comparing this profile to the 'ideal' solder profile, the main difference is that we do not dwell on the 'pre-heat' phase (ie. 150-200°C). This is because we could not get the temperature to rise fast enough, so we were forced to stick to a steady, slow ramp.

Results[edit]

The second run of 0603 resistors was a success
Some very fine pitch ICs

The results of the final profile were excellent. The main restriction of this technology is the precise application and dosing of the solder paste, and the placement of the components. We will experiment with using stencils next time. This should improve success rate significantly.

Subpages

"" has no sub pages.


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